Fault analysis:

1. Coolant leakage due to sealing issues

2. Product failure due to overheat and burnout of CP

Technical improvements:

Problems related to high-temperature burnout are solved with a unique integrated circuit board design and a manufacturing process based on the surface mount system imported from Japan;

The increase in interior diameter of the water inlet by 3mm leads to an 23% increase in water inflow;

The full R-angle transition design of the pump head results in smooth water delivery, high bearing strength, and good heat dissipation;

Pump cover is based on a design with waterproof breathable membrane, preventing controller damage from condensate water due to high-low temperature cycles;

The pump head and the pump body are assembled with a Siemens electric torque wrench with fully automatic function. 100% airtightness test is also performed to prevent water leakage.